The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Mar. 25, 2020
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Yuki Takeshima, Kyoto, JP;
Yoshihiro Hosoi, Kyoto, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H05K 1/14 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 3/181 (2013.01); H05K 3/38 (2013.01);
Abstract
A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.