The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Mar. 14, 2022
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takuya Kondo, Kanagawa, JP;

Takashi Numagi, Tokyo, JP;

Nobuaki Yamashita, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 25/16 (2023.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H01L 25/162 (2013.01); H05K 1/0225 (2013.01); H05K 1/148 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10545 (2013.01);
Abstract

An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.


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