The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jul. 17, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Matthew D. Hill, Santa Clara, CA (US);

Derek C. Krass, Cupertino, CA (US);

Benjamin Shane Bustle, Cupertino, CA (US);

Lucy Elizabeth Browning, San Francisco, CA (US);

Michael Benjamin Wittenberg, Sunnyvale, CA (US);

James B. Smith, Cupertino, CA (US);

Ashutosh Y. Shukla, Santa Clara, CA (US);

Scott A. Myers, Saratoga, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H04M 1/02 (2006.01); H04M 1/23 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0249 (2013.01); H04M 1/02 (2013.01); H04M 1/0202 (2013.01); H04M 1/0247 (2013.01); H04M 1/23 (2013.01);
Abstract

An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.


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