The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jun. 18, 2019
Applicant:

Trumpf Photonics, Inc., Cranbury, NJ (US);

Inventors:

Christoph Tillkorn, Villingendorf, DE;

Stephan Strohmaier, Berlin, DE;

Steffen Ried, Rottweil, DE;

Assignee:

TRUMPF Photonics, Inc, Cranbury, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02423 (2013.01); H01S 5/02476 (2013.01); H01S 5/4018 (2013.01); H01S 5/4031 (2013.01);
Abstract

A diode laser arrangement for the cooling of and supply of electrical current to diode laser devices, having at least two stacks, each having a diode laser device which is configured to emit a laser beam, an upper cooling device, and a lower cooling device. The diode laser device is arranged on the upper cooling device and on the lower cooling device such that the diode laser device is arranged between the upper cooling device and the lower cooling device. The upper and lower cooling devices are in each case electrically connected to the diode laser device arranged therebetween. The upper cooling device and/or the lower cooling device of a stack are in each case formed as a microchannel cooler. The upper cooling device and/or the lower cooling device of a stack in each case have substantially no electrical insulation with respect to the diode laser device arranged therebetween.


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