The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Feb. 23, 2021
Applicant:

W&wsens Devices, Inc., Los Altos, CA (US);

Inventors:

Shih-Yuan Wang, Palo Alto, CA (US);

Shih-Ping Wang, Los Altos, CA (US);

Assignee:

W&WSens Devices, Inc., Los Altos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0236 (2006.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 27/144 (2006.01); H04B 10/69 (2013.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01); H01L 31/09 (2006.01); H01L 31/103 (2006.01); H01L 31/028 (2006.01); H01L 31/107 (2006.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); H04B 10/80 (2013.01); G02B 1/00 (2006.01); G02B 6/42 (2006.01); H01L 31/077 (2012.01); H01L 31/036 (2006.01); H01L 31/075 (2012.01); H01L 31/105 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14607 (2013.01); G02B 1/002 (2013.01); G02B 6/4204 (2013.01); G02B 6/428 (2013.01); H01L 27/1443 (2013.01); H01L 27/1446 (2013.01); H01L 27/14625 (2013.01); H01L 31/02 (2013.01); H01L 31/028 (2013.01); H01L 31/02016 (2013.01); H01L 31/0232 (2013.01); H01L 31/0236 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/02363 (2013.01); H01L 31/02366 (2013.01); H01L 31/036 (2013.01); H01L 31/0352 (2013.01); H01L 31/035218 (2013.01); H01L 31/035281 (2013.01); H01L 31/075 (2013.01); H01L 31/077 (2013.01); H01L 31/09 (2013.01); H01L 31/103 (2013.01); H01L 31/105 (2013.01); H01L 31/107 (2013.01); H01L 31/1075 (2013.01); H01L 31/1804 (2013.01); H01L 31/1808 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); H04B 10/691 (2013.01); H04B 10/6971 (2013.01); H04B 10/801 (2013.01); G02B 1/005 (2013.01); Y02E 10/547 (2013.01); Y02P 70/50 (2015.11);
Abstract

Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.


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