The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jan. 20, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Roberto Mrad, Rennes, FR;

Stefan Mollov, Rennes, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01);
Abstract

An electrical power assembly, comprising: at least one multilayer base structure, at least one power device embedded in the at least one multilayer base structure, an internal electrically conductive layer positioned on each side of the multilayer base structure, the internal electrically conductive layer being connected to a respective electrical contact of the power device through connections arranged in the multilayer base structure; at least one external electrically conductive layers positioned on each side of the base structure, each external electrically conductive layer comprising at least one pre-drilled through hole, at least one internal electrically insulating layer positioned between the internal electrically conductive layer of the base structure and a respective external electrically conductive layer, at least one hole arranged in the internal electrically insulating layer and the external electrically conductive layer, a portion of each hole being formed by the pre-drilled through hole, the at least one hole being filled with electrically conductive material to form external conductive vias to connect the internal electrically conductive layer to the respective external electrically conductive layer.


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