The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Mar. 17, 2020
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Min-Feng Chung, Taichung, TW;
Ching Hsiang Yu, New Taipei, TW;
Kuan Yu Chiu, Miaoli County, TW;
Yu-Hsin Lin, Taipei, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 5/06 (2006.01); H01F 5/04 (2006.01); H05K 1/11 (2006.01); H01F 41/063 (2016.01); H01F 41/076 (2016.01); H01F 27/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01F 5/06 (2013.01); H01F 5/04 (2013.01); H01F 27/06 (2013.01); H01F 41/063 (2016.01); H01F 41/076 (2016.01); H05K 1/118 (2013.01); H05K 1/182 (2013.01); H01F 2027/065 (2013.01); H05K 1/112 (2013.01); H05K 2201/1003 (2013.01);
Abstract
A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.