The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Mar. 25, 2022
Applicant:

Impinj, Inc., Seattle, WA (US);

Inventors:

Ronald Lee Koepp, Snoqualmie, WA (US);

Harley Heinrich, Snohomish, WA (US);

Christopher J. Diorio, Shoreline, WA (US);

Assignee:

Impinj, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01P 5/02 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07754 (2013.01); G06K 19/0775 (2013.01); G06K 19/07722 (2013.01); G06K 19/07752 (2013.01); H01P 5/028 (2013.01); H01Q 1/2225 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81464 (2013.01); H01L 2224/81493 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H05K 3/321 (2013.01); H05K 3/3431 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49016 (2015.01);
Abstract

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.


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