The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Aug. 16, 2021
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Seiichiro Shinohara, Kanuma, JP;
Yasushi Akutsu, Utsunomiya, JP;
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/10 (2018.01); C09J 5/06 (2006.01); C09J 9/02 (2006.01); B29C 35/08 (2006.01); B29C 43/00 (2006.01); B29C 43/20 (2006.01); B29D 7/01 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H01R 4/04 (2006.01); B29K 63/00 (2006.01); B29K 505/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); B29C 35/0805 (2013.01); B29C 43/003 (2013.01); B29C 43/203 (2013.01); B29D 7/01 (2013.01); C09J 5/06 (2013.01); C09J 9/02 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B29C 2035/0827 (2013.01); B29K 2063/00 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0005 (2013.01); C09J 2301/208 (2020.08); C09J 2301/314 (2020.08); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29499 (2013.01); H01R 4/04 (2013.01); H05K 3/323 (2013.01); Y10T 428/24612 (2015.01);
Abstract
A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.