The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Mar. 04, 2021
Applicant:

Eaton Intelligent Power Limited, Dublin, IE;

Inventors:

Javed Abdurrazzaq Mapkar, Northville, MI (US);

Richard Mauro de Luna, Fontana, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/18 (2006.01); C08L 81/04 (2006.01); C08L 83/04 (2006.01); B29C 48/29 (2019.01); C08K 3/04 (2006.01); C08L 79/08 (2006.01); B29C 70/02 (2006.01); B29C 70/88 (2006.01); B29C 64/124 (2017.01); C08K 3/08 (2006.01); C08L 81/06 (2006.01); C08L 77/00 (2006.01); B29K 509/08 (2006.01); B29K 71/00 (2006.01); B29K 77/00 (2006.01); B29K 507/04 (2006.01);
U.S. Cl.
CPC ...
C08L 27/18 (2013.01); B29C 48/29 (2019.02); B29C 64/124 (2017.08); B29C 70/023 (2013.01); B29C 70/882 (2013.01); C08K 3/041 (2017.05); C08K 3/042 (2017.05); C08K 3/08 (2013.01); C08L 77/00 (2013.01); C08L 79/08 (2013.01); C08L 81/04 (2013.01); C08L 81/06 (2013.01); C08L 83/04 (2013.01); B29K 2071/00 (2013.01); B29K 2077/00 (2013.01); B29K 2507/04 (2013.01); B29K 2509/08 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.


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