The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Apr. 23, 2019
Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Kenji Kaneta, Tokyo, JP;

Takaaki Suzuki, Tokyo, JP;

Kouki Wakabayashi, Tokyo, JP;

Akihiro Ito, Tokyo, JP;

Naoki Sugiura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); D06M 15/55 (2006.01); D06M 15/564 (2006.01); D06M 15/53 (2006.01); D06M 15/507 (2006.01); D06M 13/224 (2006.01); D06M 10/10 (2006.01); D06M 15/59 (2006.01); C08G 59/20 (2006.01); C08J 5/06 (2006.01); D06M 15/568 (2006.01); D06M 101/40 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); C08G 59/20 (2013.01); C08J 5/06 (2013.01); D06M 10/10 (2013.01); D06M 13/224 (2013.01); D06M 15/507 (2013.01); D06M 15/53 (2013.01); D06M 15/55 (2013.01); D06M 15/564 (2013.01); D06M 15/568 (2013.01); D06M 15/59 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01); D06M 2101/40 (2013.01); D06M 2200/40 (2013.01);
Abstract

A sizing agent for carbon fiber includes component (A), component (B), and component (C), in which the component (A) is at least one selected from the group consisting of component (A-1), component (A-2), and component (A-3); the component (A-1) is a urethane compound having a structure of Formula (1-1) in the molecule, the component (A-2) is an ester compound having a structure represented by Formula (1-2) in the molecule, the component (A-3) is an amide compound having a structure of Formula (1-3) in the molecule; the component (B) is an epoxy compound selected from the group consisting of an epoxy compound represented by Formula (2), an epoxy compound represented by Formula (3), and an epoxy compound represented by Formula (4); and the component (C) is a bisphenol type epoxy compound.


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