The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Apr. 02, 2021
Applicant:
Knowles Electronics, Llc, Itasca, IL (US);
Inventors:
Assignee:
KNOWLES ELECTRONICS, LLC., Itasca, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00325 (2013.01); B81B 7/0048 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0792 (2013.01); H04R 2201/003 (2013.01);
Abstract
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.