The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Jul. 04, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventor:
Wolfgang Pahl, Munich, DE;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00309 (2013.01); B81B 7/0061 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0271 (2013.01); B81B 2201/0292 (2013.01); B81B 2207/012 (2013.01); B81B 2207/99 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0143 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/032 (2013.01); H04R 1/04 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.