The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Apr. 29, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Stanley J. Wang, Corvallis, OR (US);
Anthony M. Fuller, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B01L 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B01L 3/502715 (2013.01); B81B 7/0025 (2013.01); B01L 2200/12 (2013.01); B81B 2201/052 (2013.01);
Abstract
A microfluidic device including a fluid ejection channel defined by a fluid barrier and an orifice, or nozzle, for containing and/or passing fluids, and further including micro-electromechanical systems (MEMS) and/or electronic circuitry may be fabricated on a silicon substrate and included in a fluid ejection system. Various microfabrication techniques used for fabricating semiconductor devices may be used to manufacture such microfluidic devices.