The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Apr. 20, 2022
Applicant:

Magic Leap, Inc., Plantation, FL (US);

Inventors:

Chieh Chang, Cedar Park, TX (US);

Christophe Peroz, Tokyo, JP;

Sharad D. Bhagat, Austin, TX (US);

Roy Matthew Patterson, Hutto, TX (US);

Michael Anthony Klug, Austin, TX (US);

Charles Scott Carden, Austin, TX (US);

Assignee:

Magic Leap, Inc., Plantation, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 39/02 (2006.01); B29C 35/08 (2006.01); B29C 39/26 (2006.01); B29C 39/38 (2006.01); B29C 71/02 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00663 (2013.01); B29C 35/08 (2013.01); B29C 35/0888 (2013.01); B29C 39/026 (2013.01); B29C 39/265 (2013.01); B29C 39/38 (2013.01); B29C 71/02 (2013.01); B29C 2035/0822 (2013.01); B29C 2035/0827 (2013.01); B29C 2071/022 (2013.01);
Abstract

An example system for molding a photocurable material into a planar object includes a first mold structure having a first mold surface, a second mold structure having a second mold surface, and one or more protrusions disposed along at least one of the first mold surface or the second mold surface. During operation, the system is configured to position the first and second mold structures such that the first and second mold surfaces face each other with the one or more protrusions contacting the opposite mold surface, and a volume having a total thickness variation (TTV) of 500 nm or less is defined between the first and second mold surfaces. The system is further configured to receive the photocurable material in the volume, and direct radiation at the one or more wavelengths into the volume.


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