The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Sep. 27, 2019
Applicant:

Teijin Limited, Osaka, JP;

Inventors:

Yoshitaka Tanaka, Tokyo, JP;

Koji Kubo, Tokyo, JP;

Assignee:

Teijin Limited, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/02 (2006.01); B32B 5/12 (2006.01); B32B 7/12 (2006.01); B32B 27/38 (2006.01); B29K 63/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/026 (2013.01); B32B 5/12 (2013.01); B32B 7/12 (2013.01); B32B 27/38 (2013.01); B29K 2063/00 (2013.01); B29K 2105/089 (2013.01); B29K 2307/04 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2307/518 (2013.01); B32B 2307/732 (2013.01);
Abstract

The present invention provides: a surface-coated film which is for being integrally formed with a fiber impregnation resin; a surface-coated fiber-reinforced resin molded product; and a manufacturing method thereof. The surface-coated film has a base film B and an easily adhesive layer A provided on the base film B, wherein the base film B has a flat layer band an easily molded layer badjacent to the easily adhesive layer A, the thickness of the easily adhesive layer A is 30-250 nm, the thickness of the base film B is 50-500 μm, the easily molded layer band the flat layer bsatisfy both expression 1 of 3≤ratio (EHb/EHb) of storage elastic modulus EHbof flat layer bat 150° C. to storage elastic modulus EHbof easily molded layer bat 150° C., and expression 2 of 1,000 MPa≤storage elastic modulus ELbof easily molded layer bat 23° C.


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