The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Mar. 29, 2021
Applicants:

Yoichi Ito, Tokyo, JP;

Tsuyoshi Arao, Kanagawa, JP;

Yoichi Sakurai, Kanagawa, JP;

Tomomi Akieda, Kanagawa, JP;

Inventors:

Yoichi Ito, Tokyo, JP;

Tsuyoshi Arao, Kanagawa, JP;

Yoichi Sakurai, Kanagawa, JP;

Tomomi Akieda, Kanagawa, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/209 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/209 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A droplet discharge apparatus includes a discharge head including a nozzle, a nozzle surface observation device, and processing circuitry. The discharge head including the nozzle is configured to discharge a droplet onto a discharge receiving medium formed of powder. The nozzle surface observation device is configured to observe a nozzle surface of the nozzle of the discharge head. The processing circuitry is configured to calculate an adhesion amount of attached matter to the nozzle surface based on an observation result of the nozzle surface observation device. The processing circuitry is configured to determine, based on a calculation result of the adhesion amount of the attached matter, an operation on a control target that controls at least one of a mass and a discharge speed of the droplet.


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