The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Nov. 10, 2017
Applicant:

Divergent Technologies, Inc., Los Angeles, CA (US);

Inventors:

Kevin Robert Czinger, Santa Monica, CA (US);

Broc William TenHouten, Rancho Palos Verdes, CA (US);

Antonio Bernerd Martinez, El Segundo, CA (US);

Steven Blair Massey, Jr., Torrance, CA (US);

Narender Shankar Lakshman, Torrance, CA (US);

William David Kreig, Huntington Beach, CA (US);

Jon Paul Gunner, Palos Verdes Estates, CA (US);

David Brian TenHouten, El Segundo, CA (US);

Eahab Nagi El Naga, Topanga, CA (US);

Muhammad Faizan Zafar, Long Beach, CA (US);

Assignee:

DIVERGENT TECHNOLOGIES, INC., Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 7/08 (2006.01); G05B 19/4099 (2006.01); B28B 1/00 (2006.01); B33Y 80/00 (2015.01); G06F 30/13 (2020.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22D 23/06 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/30 (2021.01); B22F 10/66 (2021.01);
U.S. Cl.
CPC ...
B22F 7/08 (2013.01); B22F 3/105 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B28B 1/001 (2013.01); B33Y 80/00 (2014.12); G05B 19/4099 (2013.01); G06F 30/13 (2020.01); B22D 23/06 (2013.01); B22F 10/30 (2021.01); B22F 10/66 (2021.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A high precision Interface Node is disclosed. The Interface Node includes an integrated structure including one or more complex or sophisticated features and functions. The Interface Node may connect with another component or a Linking Node. The Interface Node is manufactured to achieve high precision functionality while enabling volume production. Current additive manufacturing technologies allow for the printing of high precision features to be manufactured, but generally this is performed at a slower rate. Consequently, in one aspect, the size of the Interface Nodes is reduced in order to overcome at least part of the slower production volume caused by creating the high precision Interface Nodes. The components and Linking Nodes to which the Interface Node is connected may only have basic features and functions. Accordingly, this latter category of components may use a high print rate and thus high production volume. In other embodiments, these low precision components may also be produced using a non-print manufacturing technology, such as casting, forging, etc., that may provide the requisite high throughput, or to high precision machined parts that lack the geometric flexibility of the Interface Node. In an embodiment, the Interface Nodes may be connected to other components via a Linking Node.


Find Patent Forward Citations

Loading…