The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
May. 18, 2017
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/36 (2006.01); B32B 27/08 (2006.01); C09J 7/22 (2018.01); B32B 7/12 (2006.01); C09J 133/06 (2006.01); C09J 7/30 (2018.01); B22F 3/02 (2006.01); H01L 21/52 (2006.01); C23C 28/04 (2006.01); C23C 28/00 (2006.01); C09J 11/04 (2006.01); C09J 9/02 (2006.01); C08F 220/18 (2006.01); C09J 7/10 (2018.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B22F 3/02 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); C08F 220/1808 (2020.02); C09J 7/10 (2018.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 133/066 (2013.01); C23C 28/00 (2013.01); C23C 28/04 (2013.01); C23C 28/30 (2013.01); C23C 28/34 (2013.01); H01L 21/3043 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/41 (2020.08); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.