The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Mar. 03, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Hiroshi Nakaki, Yokkaichi Mie, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/20 (2023.01); H01L 23/00 (2006.01); H10B 41/10 (2023.01); H10B 41/20 (2023.01); H10B 41/35 (2023.01); H10B 43/10 (2023.01); H10B 43/35 (2023.01); H10B 43/27 (2023.01); H10B 41/27 (2023.01); H10B 41/41 (2023.01); H10B 41/30 (2023.01);
U.S. Cl.
CPC ...
H10B 43/20 (2023.02); H01L 24/46 (2013.01); H10B 41/10 (2023.02); H10B 41/20 (2023.02); H10B 41/27 (2023.02); H10B 41/30 (2023.02); H10B 41/35 (2023.02); H10B 41/41 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02);
Abstract

According to one embodiment, a semiconductor storage device includes: a plurality of first wiring layers stacked in a first direction; a first memory pillar including a first semiconductor layer extending in the first direction and penetrating the plurality of first wiring layers; a second wiring layer disposed above the first semiconductor layer; a second semiconductor layer including a first part disposed between the first semiconductor layer and the second wiring layer, a second part extending away from the first semiconductor layer, and a third part provided on the second part; a first insulating layer disposed between the first part and the second wiring layer and between the second part and the second wiring layer; and a second insulating layer provided on the first insulating layer and in contact with at least a portion of the second part.


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