The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

May. 24, 2021
Applicant:

Lear Corporation, Southfield, MI (US);

Inventors:

Parminder Brar, Ontario, CA;

Ajmal Ansari, Canton, MI (US);

Jared Pieknik, Westland, MI (US);

Michael Scott Duco, Fraser, MI (US);

Kevin J. Foldvary, Pinckney, MI (US);

Assignee:

LEAR CORPORATION, Southfield, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H01L 23/473 (2013.01); H05K 7/20509 (2013.01); H05K 7/20927 (2013.01);
Abstract

An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.


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