The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Sep. 13, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Kazuya Nagasawa, Kamakura, JP;

Tomoaki Morita, Ome, JP;

Takahisa Funayama, Kawasaki, JP;

Norihiro Ishii, Yokohama, JP;

Hidenori Tanaka, Hachioji, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10901 (2013.01);
Abstract

According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.


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