The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Aug. 03, 2018
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Yuyao Ningbo, CN;

Bojie Zhao, Yuyao Ningbo, CN;

Zhewen Mei, Yuyao Ningbo, CN;

Nan Guo, Yuyao Ningbo, CN;

Lifeng Yao, Yuyao Ningbo, CN;

Zhenyu Chen, Yuyao Ningbo, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/57 (2023.01); B29D 11/00 (2006.01); G02B 7/02 (2021.01); B29L 11/00 (2006.01); H05K 3/00 (2006.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); B29D 11/0048 (2013.01); G02B 7/021 (2013.01); B29L 2011/0016 (2013.01); H04N 23/55 (2023.01); H05K 3/0014 (2013.01);
Abstract

A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.


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