The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Nov. 23, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Ji Hwan Park, Seoul, KR;

Myoung Jin An, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/51 (2023.01); B60R 1/00 (2022.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/51 (2023.01); B60R 1/00 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 5/006 (2013.01); H05K 5/0052 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.


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