The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Sep. 14, 2020
Applicant:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Inventors:

Garron Morris, Whitefish Bay, WI (US);

Garrett Wolff, Sussex, WI (US);

Craig Devroy, New Berlin, WI (US);

James Carter, Wauwatosa, WI (US);

Christopher Genthe, West Bend, WI (US);

Assignee:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 1/32 (2007.01); H01L 23/00 (2006.01); H02M 7/217 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H02M 1/32 (2013.01); H01L 23/564 (2013.01); H02M 7/217 (2013.01); H05K 5/0095 (2013.01);
Abstract

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. A protective cover layer includes a corrosion protection material and divides the interior space into an inner sub-space located between the base plate and the protective cover layer and an outer sub-space located between the protective cover layer and the housing. The at least one semiconductor switch is located in the inner sub-space such that an atmosphere in the outer sub-space passes through the protective cover layer of corrosion protection material before entering the inner sub-space. Additional anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.


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