The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Mar. 17, 2022
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Masatoshi Nakagaki, Komatsushima, JP;
Soichiro Miura, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/0239 (2021.01); H01S 5/40 (2006.01); H01S 5/0233 (2021.01); H01S 5/022 (2021.01); H01S 5/02345 (2021.01);
U.S. Cl.
CPC ...
H01S 5/0239 (2021.01); H01S 5/022 (2013.01); H01S 5/0233 (2021.01); H01S 5/02355 (2021.01); H01S 5/40 (2013.01); H01S 5/4031 (2013.01); H01S 5/02345 (2021.01);
Abstract
A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.