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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11784291 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Nov. 17, 2021

Light-emitting device

Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventors:

Masami Obara, Kyoto, JP;

Shigeo Hayashi, Kyoto, JP;

Assignee:

NUVOTON TECHNOLOGY CORPORATION JAPAN, Kyoto, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Antonio B Crite

Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/0095 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting device including: a mounting substrate including a mounting surface; a light-emitting element disposed on the mounting surface; a light transmissive component disposed on the light-emitting element; and a resin component directly contacting and covering a side surface of the light-emitting element and a side surface of the light transmissive component. The resin component includes a peripheral portion that directly contacts and covers the side surface of the light transmissive component, a protrusion that protrudes from the peripheral portion, and a cover portion that directly contacts and covers an outer edge portion of a topmost surface of the light transmissive component. The height from the mounting surface to a top of the cover portion is greater than a height from the mounting surface to the topmost surface of the light transmissive component, and the topmost surface of the light transmissive component includes a region exposed from the resin component.

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