The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Nov. 19, 2021
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Thales, Courbevoie, FR;
Concept Composites Auvergne—2ca, Arlanc, FR;
Julien Gaume, Grenoble, FR;
Rodolphe Chaix, Cannes la Bocca, FR;
Jean-Baptiste Billard, Cannes la Bocca, FR;
Thomas Guerin, Grenoble, FR;
Pierre Ruols, Porte de Savoie, FR;
Commissariat a l'Energie Atomique et aux Energies Alternatives, Paris, FR;
Thales, Courbevoie, FR;
Concept Composites Auvergne 2CA, Arlanc, FR;
Abstract
A photovoltaic module includes a transparent first layer forming the front side of the photovoltaic module; a plurality of photovoltaic cells placed side-by-side and electrically connected; a polymer encapsulating assembly able to encapsulate the plurality of photovoltaic cells between a lower portion and an upper portion; a second layer made of a composite material based on polymer resin and on fibres, the encapsulating assembly and the photovoltaic cells being located between the first and second layers, at least the first and second layers defining edges of the photovoltaic module, the plurality of photovoltaic cells being spaced apart by a non-zero distance Dfrom at least one edge of the photovoltaic module; the photovoltaic module further comprises a third layer made of a composite material based on polymer resin and on fibres, the layer being located below the plurality of photovoltaic cells and above the lower portion of the encapsulating assembly and forming at least one peripheral strip extending from the at least one edge toward the centre of the module, the width (L) of which is larger than or equal to the distance D.