The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Feb. 26, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuya Notsu, Kanagawa, JP;

Ayako Furesawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/498 (2006.01); H01L 23/055 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 23/055 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 23/49 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/81201 (2013.01);
Abstract

A package comprising a base is provided. An electrode and a concave portion are arranged on a first surface of the package. The base comprises a second surface on a side opposite to the first surface and a third surface. The first surface is positioned between the second and third surfaces. The electrode comprises an electrode upper surface and an electrode side surface. The concave portion comprises a concave side surface and a bottom surface positioned closer to the second surface than the concave side surface. The electrode upper surface is arranged at a position further away from the virtual plane than the bottom surface. The electrode side surface is continuous with the concave side surface. The concave portion further comprises a second side surface which faces the concave side surface and is continuous with the third surface.


Find Patent Forward Citations

Notsu, Kazuya. (2023). Package and semiconductor device (U.S. Patent No. 11784201). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784201

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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