The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Mar. 23, 2021
Applicant:

Gallant Micro. Machining Co., Ltd., New Taipei, TW;

Inventors:

Tun-Chih Shih, New Taipei, TW;

Liang-Yin Huang, New Taipei, TW;

Ee-Sun Lim, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/743 (2013.01); H01L 2224/757 (2013.01); H01L 2224/75901 (2013.01);
Abstract

A producing apparatus and a pre-bonding device are provided. The pre-bonding device includes a dispensing mechanism and a die-placing mechanism that is arranged adjacent to the dispensing mechanism. The dispensing mechanism is configured to form a plurality of adhesives onto a plurality of carriers, respectively. The die-placing mechanism includes a plurality of catchers configured to respectively hold a plurality of chips and a correction unit that is configured to adjust a relative position of the chips. The catchers are configured to synchronously place the chips adjusted by the correction unit onto the adhesives, respectively.


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