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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11784146 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Apr. 05, 2021

Method and apparatus for a ground wire bonding attachment in mmic devices

Applicant:

Scientific Components Corporation, Brooklyn, NY (US);

Inventors:

Fuad Haji Mokhtar, Kedah, MY;

Goh Chee Kheng, Pulau Pinang, MY;

Khor Gang Quan, Pulau Pinang, MY;

Alvin Yong Shee Meng, Pulau Pinang, MY;

Assignee:

Scientific Components Corporation, Brooklyn, NY (US);

Attorneys:

Lawrence G. Fridman, ESQ

FEIGIN & FRIDMAN, LLC

Primary Examiner:

Errol V Fernandes

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/48227 (2013.01);
Abstract

An apparatus and method for co-axial wire bonding to improve impedance and electrical package connection performance of a substrate attached to the interior of an electrical device package. One or more wire bonds making ground connections between a package and an internal electrical circuit substrate make a non-contact geometrical crossing over an active electrical signal wire.

Find Patent Forward Citations

Mokhtar, Fuad. (2023). Method and apparatus for a ground wire bonding attachment in mmic devices (U.S. Patent No. 11784146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784146

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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