The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Sep. 26, 2022
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

John A. Starkovich, Redondo Beach, CA (US);

Jesse B. Tice, Torrance, CA (US);

Vincent Gambin, Torrance, CA (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3736 (2013.01);
Abstract

A semiconductor device is provided with a first layer having a first layer conductive contact and being doped at a first concentration of a first dopant type. The first dopant type being a P type dopant. A second layer is on top the first layer and being doped at a second concentration of the first dopant type. The second concentration being less than the first concentration. A third layer is on top of the second layer and having a third layer conductive contact and being doped with a second dopant type, the second dopant type being an N type dopant. A fourth layer is on top of the third layer and having a fourth layer conductive contact and being doped with the first dopant type, wherein at least one of the first and second layers is a boron arsenide (BAs) layer.


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