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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11784100 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Oct. 15, 2021

Method of manufacturing a molded flip chip package to facilitate electrical testing

Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventors:

Jee Won Chung, Seoul, KR;

Dong Jin Kim, Icheon-si, KR;

Byeung Ho Kim, Cheongju-si, KR;

Chang Hyun Kim, Hwaseong-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:

WILLIAM PARK & ASSOCIATES LTD.

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/67242 (2013.01); H01L 21/78 (2013.01); H01L 24/81 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A method of manufacturing a flip chip package includes forming a plurality of semiconductor chips and bonding the semiconductor chips to a package substrate. The method further includes electrically testing the plurality of semiconductor chips on the package substrate, molding the tested semiconductor chips, and singulating the molded chips. Electrically testing the semiconductor chips includes covering the semiconductor chips with a protection member.

Find Patent Forward Citations

Chung, Jee. (2023). Method of manufacturing a molded flip chip package to facilitate electrical testing (U.S. Patent No. 11784100). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784100

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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