The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Oct. 29, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-Si, KR;

Inventors:

Heung Yeol Na, Suwon-si, KR;

Kang Won Lee, Gumi-si, KR;

Yoon Jae Lee, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-Si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); B25J 15/00 (2006.01); B25J 9/00 (2006.01); B25J 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B25J 9/0087 (2013.01); B25J 9/026 (2013.01); B25J 15/0052 (2013.01); H01L 21/67144 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.


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