The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Jul. 30, 2021
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Dong Hwi Shin, Suwon-si, KR;
Dong Yeong Kim, Suwon-si, KR;
Do Yeon Kim, Suwon-si, KR;
Woo Chul Shin, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1≤t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3≤t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.