The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Jan. 25, 2021
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Cory Edward Sherman, Annapolis, MD (US);

Shawn A. Keebaugh, Annapolis, MD (US);

Reuben C. Ferguson, Richmond, VA (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/72 (2013.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H10N 69/00 (2023.01);
U.S. Cl.
CPC ...
G06F 21/72 (2013.01); H01L 23/5228 (2013.01); H01L 23/53285 (2013.01); H10N 69/00 (2023.02);
Abstract

A method of forming a superconducting structure is provided that includes forming a superconducting element in a first dielectric layer, forming a protective pad formed from a resistive material over at least a portion of the superconducting element, forming a second dielectric layer overlying the first dielectric layer, and etching an opening through the second dielectric layer to the protective pad, such that no portion of the superconducting element is exposed in the opening. A cleaning process is performed on the superconducting structure, and a contact material fill with a resistive material is performed to fill the opening and form a resistive element in contact with the superconducting element through the protective pad.


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