The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Mar. 22, 2019
Sanyo Special Steel Co., Ltd., Himeji, JP;
Yuka Saimen, Himeji, JP;
Sanyo Special Steel Co., Ltd., Himeji, JP;
Abstract
Provided is a powder for metal molds that is less likely to cause solidification cracking even in a process involving rapid melt-quenching solidification. The powder for metal molds is made of an alloy. The alloy includes C: 0.25 mass % to 0.45 mass %, Si: 0.01 mass % to 1.20 mass %, Mn: more than 0 mass % to 1.50 mass %, Cr: 2.0 mass % to 5.5 mass %, and V: 0.2 mass % to 2.1 mass %. The alloy further includes at least one of Mo: more than 0 mass % to 3.0 mass %, W: more than 0 mass % to 9.5 mass %, and Co: more than 0 mass % to 4.5 mass %. The balance of the alloy is Fe and incidental impurities. The alloy satisfies the expression: (Mn %)/S %>6.7. The total content of P, S and B in the alloy is 0.020 mass % or less.