The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Nov. 03, 2020
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Naiyong Jing, St. Paul, MN (US);

Cheng Gu, Golden Valley, MN (US);

Klaus Hintzer, Kastl, DE;

Tho Q. Nguyen, Bloomington, MN (US);

Peter J. Scott, Stillwater, MN (US);

Cheng Li, Shanghai, CN;

Zai-Ming Qiu, Woodbury, MN (US);

Yong Wu, Woodbury, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/44 (2006.01); C08L 27/18 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08L 27/18 (2013.01); C08K 3/36 (2013.01); H01B 3/445 (2013.01); C08K 2201/001 (2013.01); C08L 2203/206 (2013.01); C08L 2312/06 (2013.01);
Abstract

Electronic telecommunication articles are described comprising a crosslinked fluoropolymer layer. In typical embodiments, the crosslinked fluoropolymer layer is a substrate, patterned (e.g. photoresist) layer, insulating layer, passivation layer, cladding, protective layer, or a combination thereof. Also describes are methods of making an electronic telecommunications article and method of forming a patterned fluoropolymer layer. The fluoropolymer preferably comprises at least 80, 85, or 90% by weight of polymerized units of perfluorinated monomers and cure sites selected from nitrile, iodine, bromine, and chlorine. Illustrative electronic communication articles include integrated circuits, printed circuit boards, antennas, and optical fiber cables. Fluoropolymer compositions are also described.


Find Patent Forward Citations

Loading…