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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11780965 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Feb. 08, 2022

Polyamide-imide film and preparation method thereof

Applicant:

SK Microworks Co., Ltd., Gyeonggi-do, KR;

Inventors:

Dawoo Jeong, Gyeonggi-do, KR;

Sunhwan Kim, Incheon, KR;

Dae Seong Oh, Seoul, KR;

Jin Woo Lee, Gyeonggi-do, KR;

Dong Jin Lim, Gyeonggi-do, KR;

Assignee:

SK microworks Co., Ltd., Gyeonggi-do, KR;

Attorney:

IP & T GROUP LLP

Primary Examiner:

Gregory Listvoyb

Int. Cl.
CPC ...
C08G 73/14 (2006.01); C08J 5/18 (2006.01); C08G 73/10 (2006.01); B29C 39/00 (2006.01); B29C 39/14 (2006.01); B29C 39/38 (2006.01); B29K 79/00 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
C08G 73/14 (2013.01); B29C 39/003 (2013.01); B29C 39/14 (2013.01); B29C 39/38 (2013.01); C08G 73/1032 (2013.01); C08J 5/18 (2013.01); B29K 2079/085 (2013.01); B29L 2007/008 (2013.01); C08J 2379/08 (2013.01);
Abstract

Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m.

Find Patent Forward Citations

Jeong, Dawoo. (2023). Polyamide-imide film and preparation method thereof (U.S. Patent No. 11780965). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11780965

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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