The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Mar. 16, 2020
Piana Nonwovens, Llc, Cartersville, GA (US);
Andy Hollis, Cartersville, GA (US);
Michael Stephen Defranks, Cartersville, GA (US);
Eric McCann, Cartersville, GA (US);
Mehran Jafari, Cartersville, GA (US);
Helias Andriessen, Cartersville, GA (US);
Sang-hoon Lim, Cartersville, GA (US);
Andrea Piana, Cartersville, GA (US);
Alfio Borgatti, Cartersville, GA (US);
PIANA NONWOVENS, LLC, Cartersville, GA (US);
Abstract
A three-dimensional component is produced in a simplified molding operation. Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. Boards can be formed by laminating two or more blanks together and/or by laminating the blanks with other materials, including non-expendable materials. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. In addition, the boards or blanks may be cut to create desired shapes of parts that can be placed in the mold.