The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Dec. 07, 2018
Honda Motor Co., Ltd., Tokyo, JP;
Kado Corporation, Hyogo, JP;
National University Corporation Tokai National Higher Education and Research System, Aichi, JP;
Toray Industries, Inc., Tokyo, JP;
Teijin Limited, Osaka, JP;
Subaru Corporation, Tokyo, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi, JP;
Kyowa Industrial Co., Ltd., Niigata, JP;
Satoshi Hirawaki, Wako, JP;
Yoshiaki Matsumoto, Tatsuno, JP;
Shunya Hatanaka, Nagoya, JP;
Takashi Kusaka, Nagoya, JP;
Yasunari Kuratani, Tatsuno, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
KADO CORPORATION, Tatsuno, JP;
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM, Nagoya, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
TEIJIN LIMITED, Osaka, JP;
SUBARU CORPORATION, Tokyo, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
KYOWA INDUSTRIAL CO., LTD., Sanjo, JP;
Abstract
An apparatus for manufacturing a thermoplastic resin material, including: a mold for molding a base material containing a thermoplastic resin into a predetermined shape; and a transfer mechanism that places the base material in the mold, wherein the transfer mechanism includes a detection mechanism that detects a state of the base material, and a controlling unit that controls operation of the mold and the transfer mechanism.