The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Jan. 18, 2018
Applicant:

SK Enpulse Co., Ltd., Gyeonggi-do, KR;

Inventors:

Joonsung Ryou, Gyeonggi-do, KR;

Tae Kyoung Kwon, Ulsan, KR;

Jang Won Seo, Busan, KR;

Sunghoon Yun, Gyeonggi-do, KR;

Assignee:

SK ENPULSE CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 18/00 (2006.01); B24B 37/20 (2012.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
B24D 18/0045 (2013.01); B24B 37/205 (2013.01); B24B 37/22 (2013.01);
Abstract

Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; interposing an adhesive layer between the polishing layer, which has the first through-hole, and support layer, and adhering the polishing layer and support layer to each other by means of the adhesive layer; forming, with the first through-hole as a reference point, a third through-hole penetrating the adhesive layer on a set area thereof, and a second through-hole penetrating the support layer on a set area thereof; and inserting a window inside the first through-hole.


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