The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Nov. 19, 2021
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventor:

Akihiro Chida, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/842 (2023.01); H10K 59/38 (2023.01); H10K 59/131 (2023.01); H10K 59/121 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/8426 (2023.02); H10K 59/1213 (2023.02); H10K 59/131 (2023.02); H10K 59/38 (2023.02); H10K 71/00 (2023.02); H10K 77/111 (2023.02); H10K 59/1201 (2023.02); H10K 2102/311 (2023.02); H10K 2102/351 (2023.02); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11);
Abstract

A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.


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