The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 15, 2022
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Hui-Ru Wu, Hsinchu, TW;

Jian-Chin Liang, Hsinchu, TW;

Jo-Hsiang Chen, Hsinchu, TW;

Lung-Kuan Lai, Hsinchu, TW;

Cheng-Yu Tsai, Hsinchu, TW;

Hsin-Lun Su, Hsinchu, TW;

Ting-Kai Chen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/125 (2023.01); H01L 33/60 (2010.01); H10K 50/856 (2023.01); H10K 50/86 (2023.01); H10K 50/80 (2023.01);
U.S. Cl.
CPC ...
H10K 50/125 (2023.02); H01L 33/60 (2013.01); H10K 50/856 (2023.02); H10K 50/865 (2023.02); H10K 50/868 (2023.02);
Abstract

A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.


Find Patent Forward Citations

Loading…