The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Dec. 24, 2020
Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Peng Ding, Beijing, CN;
Zhixiang Fang, Beijing, CN;
Guanglei Yang, Beijing, CN;
Meng Wang, Beijing, CN;
Xuxu Hu, Beijing, CN;
Hefei BOE Optoelectronics Technology Co., Ltd., Anhui, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.