The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Aug. 27, 2020
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Ilias Nikolaidis, Hanau, DE;

Alexander Zimmermann, Hanau, DE;

Thomas Lauinger, Hanau, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H01L 23/48 (2006.01); H05K 3/32 (2006.01); B05D 3/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); B05D 3/067 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H05K 2203/0278 (2013.01);
Abstract

One aspect relates to a method of manufacture of an electronic assembly comprising at least these steps: providing a substrate having at least a first contact area; positioning a spot of a UV curable substance on the substrate; positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of curable substance; exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally connecting the first contact area with the electrically conductive item. One aspect relates to an electronic assembly comprising a substrate with a contact area, a spot of a cured substance on the substrate and an electrically conductive item that is in electrically conductive connection with the first contact area and mechanically connected through the spot of cured substance to the substrate.


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