Circuit board with embedded electronic component and method for manufacturing the same

Abstract

A method for manufacturing a circuit board () includes: providing a first single-sided circuit substrate () including an insulating base layer () and a circuit layer (); forming first conductive posts () electrically connected to the circuit layer () in the insulating base layer () to obtain a second single-sided circuit substrate (); providing a first adhesive layer (), forming second conductive posts (); providing one second single-sided circuit substrate (), defining a receiving groove () to obtain a third single-sided circuit substrate (); providing another first single-sided circuit substrate (), mounting an electronic component () on the circuit layer () to obtain a surface mounted circuit substrate (); stacking the first single-sided circuit substrate (), the first adhesive layer (), the second single-sided circuit substrate (), at least one of the third single-sided circuit substrate (), and the surface mounted circuit substrate () in that order; pressing the intermediate body ().