The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Apr. 09, 2021
Applicants:

Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Tsung-Po Hsu, Taipei, TW;

Yung-Chou Li, Taipei, TW;

Yu-Jen Wei, Taipei, TW;

Chih-Chun Yang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H02M 7/003 (2013.01); H05K 7/2039 (2013.01); H05K 2201/1003 (2013.01);
Abstract

An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.


Find Patent Forward Citations

Hsu, Tsung-Po. (2023). Assembly structure of transformer and circuit board as well as assembly method thereof (U.S. Patent No. 11778746). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11778746

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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