The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 05, 2023
Applicant:

Fcnt Limited, Yamato, JP;

Inventors:

Takahiro Shinojima, Yamato, JP;

Hirofumi Sakamoto, Yamato, JP;

Yohei Koga, Yamato, JP;

Manabu Yoshikawa, Yamato, JP;

Fuyuki Hikita, Yamato, JP;

Assignee:

FCNT LIMITED, Yamato, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01Q 9/06 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 3/18 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A printed circuit board includes a dielectric substrate which is formed in a plate-like shape, ground conductor layers which are respectively provided on a top surface and a back surface of the dielectric substrate, a signal line which is provided on a side surface of the dielectric substrate, and transmits a high frequency signal, and a plurality of connection conductors which are provided in the dielectric substrate, connects the ground conductor layer provided on the top surface and the ground conductor layer provided on the back surface, and are aligned and disposed along the signal line.


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