The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jun. 09, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Tomohiro Yamazaki, Kanagawa, JP;

Yoshinori Muramatsu, Kanagawa, JP;

Shigetaka Kudo, Kanagawa, JP;

Kazuhiko Muraoka, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 25/53 (2023.01); H04N 25/75 (2023.01); H04N 25/79 (2023.01);
U.S. Cl.
CPC ...
H04N 25/53 (2023.01); H04N 25/75 (2023.01); H04N 25/79 (2023.01);
Abstract

Image quality is to be improved in a solid-state image pickup element that performs time delay integration. A correlated double sampling circuit generates a frame in which a predetermined number of lines each including a plurality of digital signals are arranged. A TDI frame memory retains a (K−1)-th frame generated before a K-th frame. A time delay integration circuit performs time delay integration processing of adding the line having a predetermined address in the K-th frame and the line having an address at a certain distance from the predetermined address in the (K−1)-th frame.


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